Invention Grant
- Patent Title: Packaging structure, display panel and display device including microstructure layer
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Application No.: US17228791Application Date: 2021-04-13
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Publication No.: US11758756B2Publication Date: 2023-09-12
- Inventor: Ming Liu
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Lippes Mathias LLP
- Priority: CN 2011035741.5 2020.09.27
- Main IPC: H01L51/52
- IPC: H01L51/52

Abstract:
Provided is a packaging structure, including an inorganic packaging layer and an organic packaging layer that are laminated on a substrate, wherein the organic packaging layer includes a microstructure layer and a planarization layer, a refractive index of the planarization layer being lower than that of the microstructure layer; wherein the microstructure layer includes a base structure on the inorganic packaging layer and a plurality of protrusion structures spaced apart on a surface of the base structure away from the inorganic packaging layer; and the planarization layer fills at least gaps between adjacent protrusion structures, and a side of the planarization layer away from the inorganic packaging layer is of a planar structure.
Public/Granted literature
- US20220102677A1 PACKAGING STRUCTURE, DISPLAY PANEL AND DISPLAY DEVICE Public/Granted day:2022-03-31
Information query
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