发明授权
- 专利标题: Packaging structure, display panel and display device including microstructure layer
-
申请号: US17228791申请日: 2021-04-13
-
公开(公告)号: US11758756B2公开(公告)日: 2023-09-12
- 发明人: Ming Liu
- 申请人: BOE TECHNOLOGY GROUP CO., LTD.
- 申请人地址: CN Beijing
- 专利权人: BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人: BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人地址: CN Beijing
- 代理机构: Lippes Mathias LLP
- 优先权: CN 2011035741.5 2020.09.27
- 主分类号: H01L51/52
- IPC分类号: H01L51/52
摘要:
Provided is a packaging structure, including an inorganic packaging layer and an organic packaging layer that are laminated on a substrate, wherein the organic packaging layer includes a microstructure layer and a planarization layer, a refractive index of the planarization layer being lower than that of the microstructure layer; wherein the microstructure layer includes a base structure on the inorganic packaging layer and a plurality of protrusion structures spaced apart on a surface of the base structure away from the inorganic packaging layer; and the planarization layer fills at least gaps between adjacent protrusion structures, and a side of the planarization layer away from the inorganic packaging layer is of a planar structure.
公开/授权文献
- US20220102677A1 PACKAGING STRUCTURE, DISPLAY PANEL AND DISPLAY DEVICE 公开/授权日:2022-03-31
信息查询
IPC分类: