Invention Grant
- Patent Title: Electroconductive layered product, touch panel, and process for producing electroconductive layered product
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Application No.: US17647111Application Date: 2022-01-05
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Publication No.: US11760070B2Publication Date: 2023-09-19
- Inventor: Yoshimasa Ogawa , Yukimitsu Iwata , Yuji Shimizu , Eiji Ooishi , Shoichiro Ogumi , Norinaga Nakamura
- Applicant: DAI NIPPON PRINTING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP 15077752 2015.04.06 JP 15077753 2015.04.06 JP 15194903 2015.09.30 JP 15194904 2015.09.30
- Main IPC: B32B27/20
- IPC: B32B27/20 ; B32B37/00 ; B32B38/00 ; G06F3/041

Abstract:
The present invention aims to provide a conductive layered body having excellent solvent resistance and scratch resistance as well as a low haze value and a significantly high light transmittance. The present invention relates to a conductive layered body including, as an outermost layer thereof, a conductive layer containing a conductive fibrous filler, wherein the conductive layered body has a Martens hardness of 150 to 3,000 N/mm2 as measured at an indentation depth of 100 nm from a surface, and a ratio, in atomic percentage, of a conductive material element constituting the conductive fibrous filler on an outermost surface-side surface of the conductive layer is 0.15 to 5.00 at %.
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