- Patent Title: Heat exchanger with a bond and a method for manufacturing the same
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Application No.: US17051645Application Date: 2019-05-09
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Publication No.: US11761716B2Publication Date: 2023-09-19
- Inventor: Juha Ojanperä
- Applicant: Valmet Technologies Oy
- Applicant Address: FI Espoo
- Assignee: VALMET TECHNOLOGIES OY
- Current Assignee: VALMET TECHNOLOGIES OY
- Current Assignee Address: FI Espoo
- Agency: Alston & Bird LLP
- Priority: FI 185466 2018.05.21
- International Application: PCT/FI2019/050363 2019.05.09
- International Announcement: WO2019/224424A 2019.11.28
- Date entered country: 2020-10-29
- Main IPC: F28F9/013
- IPC: F28F9/013 ; F28D1/047 ; F28F9/26 ; F22B37/20

Abstract:
A heat exchanger having a first heat transfer tube with a first primary straight part and a first secondary straight part is provided. The heat exchanger includes a first primary bond part and a first secondary bond part. The first primary bond part is welded to the first secondary bond part to form a first primary bond that bonds the first primary straight part and the first secondary straight part of the first heat transfer tube. The first primary bond limits a first primary aperture and a first secondary aperture formed by the holes of the bond parts, wherein the straight parts of the first heat transfer tube extend through the first primary bond via the apertures.
Public/Granted literature
- US20210231389A1 A HEAT EXCHANGER WITH A BOND AND A METHOD FOR MANUFACTURING THE SAME Public/Granted day:2021-07-29
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