- 专利标题: Scintillator array, method for manufacturing scintillator array, radiation detector, and radiation inspection device
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申请号: US17660658申请日: 2022-04-26
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公开(公告)号: US11762106B2公开(公告)日: 2023-09-19
- 发明人: Hiroyasu Kondo , Kazumitsu Morimoto
- 申请人: KABUSHIKI KAISHA TOSHIBA , TOSHIBA MATERIALS CO., LTD.
- 申请人地址: JP Tokyo
- 专利权人: KABUSHIKI KAISHA TOSHIBA,TOSHIBA MATERIALS CO., LTD.
- 当前专利权人: KABUSHIKI KAISHA TOSHIBA,TOSHIBA MATERIALS CO., LTD.
- 当前专利权人地址: JP Tokyo; JP Yokohama
- 代理机构: BURR PATENT LAW, PLLC
- 优先权: JP 19198878 2019.10.31
- 主分类号: G01T1/20
- IPC分类号: G01T1/20 ; A61B6/00 ; C09K11/02 ; C09K11/77 ; A61B6/03 ; G01N23/046
摘要:
A scintillator array includes: a structure having at least one scintillator segment and a first reflective layer, the at least one scintillator segment and the first reflective layer having a first surface and a second surface, the at least one scintillator segment having a sintered compact containing a rare earth oxysulfide phosphor, and the first reflective layer being configured to reflect light; and a second reflective layer provided above the first surface via an adhesive layer, the adhesive layer having a thickness of 2 μm or more and 40 μm or less, and the second reflective layer having a film configured to reflect light.
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