Invention Grant
- Patent Title: Hinge module and foldable electronic device including the same
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Application No.: US18117629Application Date: 2023-03-06
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Publication No.: US11762433B2Publication Date: 2023-09-19
- Inventor: Jungjin Kim , Jongyoon Kim , Chungkeun Yoo , Jongmin Kang , Suman Lee , Sungkyu Hwang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Cha & Reiter, LLC
- Priority: KR 20190019576 2019.02.19
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H04M1/02

Abstract:
A hinge module according to one embodiment includes a fixed structure including a central portion, a guide portion having an edge facing an edge of the central portion, and a support portion configured to connect the central portion and the guide portion, wherein an interior space is formed between the central portion and the guide portion, a connecting shaft extending into the interior space through the central portion and including a gear formed on at least a part of an outer circumferential surface of the connecting shaft, and a rotary structure disposed in the interior space, the rotary structure including a circular arc shaped gear having a plurality of gear teeth arranged in a circular arc shape and that are engaged with the gear, wherein the rotary structure rotates about a virtual axis of rotation passing through a center of a circular arc of the circular arc shaped gear.
Public/Granted literature
- US20230205281A1 HINGE MODULE AND FOLDABLE ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2023-06-29
Information query