Invention Grant
- Patent Title: Electronic component including insulating layer between body and shielding layer
-
Application No.: US17482051Application Date: 2021-09-22
-
Publication No.: US11763986B2Publication Date: 2023-09-19
- Inventor: Chan Yoon , Sang Soo Park , Hwi Dae Kim , Woo Chul Shin , Ji Hong Jo
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20190074972 2019.06.24
- Main IPC: H01G2/22
- IPC: H01G2/22 ; H01G4/224 ; H01G4/30 ; H01G4/232 ; H01G4/12

Abstract:
An electronic component includes a capacitor body including a dielectric layer and first and second internal electrodes, and a first to sixth surfaces, the first and the second internal electrodes being exposed through the third and the fourth surfaces, respectively; first and second external electrodes respectively extending from the third and fourth surfaces of the body to a portion of the first surface and respectively connected to the first and second internal electrodes; a shielding layer comprising a cap portion disposed on the second surface of the capacitor body and a side wall portion disposed on the third, fourth, fifth and sixth surfaces of the capacitor body; and an insulating layer disposed between the capacitor body and the shielding layer. A lower portion of the capacitor body is exposed from the insulating layer and the shielding layer.
Public/Granted literature
- US20220005646A1 ELECTRONIC COMPONENT Public/Granted day:2022-01-06
Information query