- 专利标题: Wafer cleaning apparatus and method
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申请号: US17350036申请日: 2021-06-17
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公开(公告)号: US11764081B2公开(公告)日: 2023-09-19
- 发明人: Jieh-Chau Huang , Bi-Ming Yen , Hung-Lung Hu , Ying Ting Hsia , Ping-Jung Huang , Pei Yen Hsia
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- 分案原申请号: US16100635 2018.08.10
- 主分类号: H01L21/67
- IPC分类号: H01L21/67 ; H01L21/673 ; H01L21/687
摘要:
The present disclosure relates to an apparatus for wafer cleaning. The apparatus includes an enclosure made of a noncombustible material, a wafer holder, a cleaning nozzle, at least one sensor, and an exhaust unit. The wafer holder can hold and heat a wafer. The cleaning nozzle can supply a flow of a cleaning fluid onto a surface of the wafer. The at least one sensor can detect attributes of the wafer. The exhaust unit can expel a vapor generated by the cleaning fluid in the enclosure. The exhaust unit can include a rinse nozzle to rinse the vapor passing through the exhaust unit with a mist.
公开/授权文献
- US20210313200A1 WAFER CLEANING APPARATUS AND METHOD 公开/授权日:2021-10-07
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