Invention Grant
- Patent Title: Molding packaging material, power storage device packaging case, and power storage device
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Application No.: US16644569Application Date: 2018-08-17
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Publication No.: US11766848B2Publication Date: 2023-09-26
- Inventor: Kenji Yoshino , Makoto Karatsu , Takashi Nagaoka
- Applicant: SHOWA DENKO PACKAGING CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: SHOWA DENKO PACKAGING CO., LTD.
- Current Assignee: SHOWA DENKO PACKAGING CO., LTD.
- Current Assignee Address: JP Kanagawa
- Agency: MILLEN, WHITE, ZELANO & BRANIGAN, P.C.
- Agent William Nixon; Wan-Ching Montfort
- Priority: JP 17170957 2017.09.06 JP 17170958 2017.09.06 JP 17179875 2017.09.20 JP 17180007 2017.09.20
- International Application: PCT/JP2018/030478 2018.08.17
- International Announcement: WO2019/049630A 2019.03.14
- Date entered country: 2020-03-05
- Main IPC: B23B15/00
- IPC: B23B15/00 ; B32B15/085 ; H01M50/231 ; H01M50/202 ; B32B7/12 ; B32B27/18 ; B32B37/12 ; B32B38/00 ; B65D65/40 ; H01M10/0525 ; H01M50/105

Abstract:
Provided is a molding packaging material which is capable of ensuring good slipperiness to secure good formability when molding the molding packaging material and is less likely to cause white powder on a surface of the packaging material. The molding packaging material includes a substrate layer 2 as an outer layer, a heat fusible resin layer 3 as an inner layer, and a metal foil layer 4 arranged between the two layers. The heat fusible resin layer 3 is composed of a single layer or a multi-layer. The innermost layer of the heat fusible resin layer 3 is made of a resin composition containing a heat fusible resin, an anti-blocking agent, a slip agent, and a fluoropolymer-based lubricant.
Public/Granted literature
- US20210362473A1 MOLDING PACKAGING MATERIAL, POWER STORAGE DEVICE PACKAGING CASE, AND POWER STORAGE DEVICE Public/Granted day:2021-11-25
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