Invention Grant
- Patent Title: Board having multilayer capacitor mounted thereon and multilayer capacitor package
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Application No.: US17349275Application Date: 2021-06-16
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Publication No.: US11769633B2Publication Date: 2023-09-26
- Inventor: Gu Won Ji , Heung Kil Park , Sang Soo Park , Young Ghyu Ahn
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20190116376 2019.09.20 KR 20200099136 2020.08.07
- The original application number of the division: US16990288 2020.08.11
- Main IPC: H01G4/008
- IPC: H01G4/008 ; H01G4/012 ; H01G4/12 ; H01G4/228 ; H01G4/30 ; H05K1/11 ; H05K1/18

Abstract:
An electronic component includes a board having first and second electrode pads on one surface of the board; and a multilayer capacitor. The multilayer capacitor comprises: a capacitor body comprising a dielectric layer and a plurality of internal electrodes, disposed horizontally with respect to a mounting surface of the capacitor body facing the one surface of the board, and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. The electronic component satisfies Lp/Lc≤1.35, where a distance between outer edges of the first and second electrode pads is defined as Lp, and a length of the multilayer capacitor is defined as Lc.
Public/Granted literature
- US20210313115A1 BOARD HAVING MULTILAYER CAPACITOR MOUNTED THEREON AND MULTILAYER CAPACITOR PACKAGE Public/Granted day:2021-10-07
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