Invention Grant
- Patent Title: Method of cutting a substrate along dividing lines
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Application No.: US16945729Application Date: 2020-07-31
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Publication No.: US11769852B2Publication Date: 2023-09-26
- Inventor: Masayuki Ibaraki , Minoru Yamamoto , Naoto Inoue , Hiroaki Tamemoto
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: HUNTON ANDREWS KURTH LLP
- Priority: JP 19143119 2019.08.02
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/00 ; H01L25/075 ; H01L33/20
Abstract:
A method of manufacturing a light emitting element according to certain embodiments of the present disclosure includes: scanning and irradiating a first laser light having a first irradiation intensity to a sapphire substrate along predetermined dividing lines collectively in a shape of a tessellation of a plurality of hexagonal shapes in a top view to create a plurality of first modified regions along the predetermined dividing lines; and scanning and irradiating a second laser light having a second irradiation intensity greater than the first irradiation intensity to the sapphire substrate along the predetermined dividing lines to create a plurality of second modified regions overlapping the plurality of first modified regions.
Public/Granted literature
- US20210036182A1 METHOD OF MANUFACTURING LIGHT EMITTING ELEMENT Public/Granted day:2021-02-04
Information query
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