Invention Grant
- Patent Title: Reconfigurable intelligent surface link identification
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Application No.: US17305002Application Date: 2021-06-29
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Publication No.: US11770171B2Publication Date: 2023-09-26
- Inventor: Yucheng Dai , Wooseok Nam , Tao Luo , Peter Gaal
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: QUALCOMM Incorporated
- Main IPC: H04B7/06
- IPC: H04B7/06

Abstract:
Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a receiver may receive, from a transmitter, an indication of a signature of a reconfigurable intelligent surface (RIS). The receiver may receive a signal that is transmitted by the transmitter and redirected by the RIS. The receiver may receive, from the RIS, a sequence associated with the signature of the RIS indicating that the signal is transmitted using a link associated with the RIS. Numerous other aspects are described.
Public/Granted literature
- US20220416869A1 RECONFIGURABLE INTELLIGENT SURFACE LINK IDENTIFICATION Public/Granted day:2022-12-29
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