- 专利标题: Printed circuit board
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申请号: US17224615申请日: 2021-04-07
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公开(公告)号: US11770894B2公开(公告)日: 2023-09-26
- 发明人: Hiroki Okada
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR 20200091153 2020.07.22
- 主分类号: H05K1/02
- IPC分类号: H05K1/02
摘要:
A printed circuit board includes a rigid region and a flexible region; a first substrate disposed on the rigid region and the flexible region and comprising a first insulating layer and a first wiring layer comprising a first groove in the flexible region; and a second substrate disposed on the first substrate in the rigid region and comprising a first adhesive layer, a second insulating layer and a second wiring layer.
公开/授权文献
- US20220030704A1 PRINTED CIRCUIT BOARD 公开/授权日:2022-01-27
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