- Patent Title: Systems and methods for coupling a metal core PCB to a heat sink
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Application No.: US17734105Application Date: 2022-05-01
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Publication No.: US11774082B2Publication Date: 2023-10-03
- Inventor: Dung Duong , Randall Johnson , Nicholas Klase
- Applicant: FLUENCE BIOENGINEERING, INC.
- Applicant Address: US TX Austin
- Assignee: FLUENCE BIOENGINEERING, INC.
- Current Assignee: FLUENCE BIOENGINEERING, INC.
- Current Assignee Address: US TX Austin
- Main IPC: F21V29/00
- IPC: F21V29/00 ; F21V21/20 ; F21V29/502 ; F21V29/74 ; F21V29/76 ; A01G9/24 ; F21V29/75 ; F21V23/00 ; H05K7/20 ; F28F3/02 ; H01L23/367 ; H05K1/02 ; F21V29/83 ; A01G9/20 ; H05K1/05 ; H05K3/00 ; F28D21/00 ; F21W131/40 ; F21Y103/10 ; F21V29/67 ; F21Y115/10 ; F21V19/00

Abstract:
Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.
Public/Granted literature
- US20220260240A1 Systems and Methods for Coupling a Metal Core PCB to a Heat Sink Public/Granted day:2022-08-18
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