Invention Grant
- Patent Title: Touch sensing module and electronic device including the same
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Application No.: US17388234Application Date: 2021-07-29
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Publication No.: US11775099B2Publication Date: 2023-10-03
- Inventor: Hee Sun Oh , Gye Won Lee , Hong Seok Lee , Chang Ju Lee , Jong Yun Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR 20200133941 2020.10.16 KR 20210036792 2021.03.22
- Main IPC: G06F3/041
- IPC: G06F3/041 ; G06F3/044 ; H03K17/96
Abstract:
A touch sensing module includes a sensing coil, a metal portion disposed to be spaced apart from the sensing coil, and a first bracket having one surface, on which the metal portion is disposed, and an other surface, opposing the one surface, on which a pad having a capacitance, configured to vary as a touch is applied, is disposed.
Public/Granted literature
- US20220121340A1 TOUCH SENSING MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2022-04-21
Information query
