Invention Grant
- Patent Title: Connector, wiring structure and inter-board connection method
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Application No.: US17632859Application Date: 2020-07-31
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Publication No.: US11777241B2Publication Date: 2023-10-03
- Inventor: Nobukazu Kato
- Applicant: ACES Japan Co., Ltd. , ACES Electronics Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: ACES Japan Co., Ltd.,ACES Electronics Co., Ltd.
- Current Assignee: ACES Japan Co., Ltd.,ACES Electronics Co., Ltd.
- Current Assignee Address: JP Tokyo; TW Taiwan
- Agency: Shih IP Law Group, PLLC
- Priority: JP 19143542 2019.08.05
- International Application: PCT/JP2020/029449 2020.07.31
- International Announcement: WO2021/024941A 2021.02.11
- Date entered country: 2022-02-04
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/81

Abstract:
Provided is a wiring structure with which a module board of one mobile communication apparatus can be connected to a circuit board of another mobile communication apparatus by using an optimal wiring material. The present invention is provided with: a main board 2; a first module board 8; a first connector that can be fitted to a coaxial cable connector and a connector mounted on a flexible printed board and that is mounted on the first module board; a second connector 10 fitted to the first connector; and wiring materials 6a, 6b, 14a-14e that are attached to the second connector and electrically connect the main board and the first module board.
Public/Granted literature
- US20220320775A1 CONNECTOR AND WIRING STRUCTURE Public/Granted day:2022-10-06
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