A camera module includes a circuit board, a photosensitive chip, a filter, a l holder, and a lens assembly. A receiving groove is recessed from a surface of the circuit board. The photosensitive chip is received in the receiving groove. The holder is mounted on the surface of the circuit board and covers the photosensitive chip. The filter is mounted in the holder and spaced from the photosensitive chip. The lens assembly is mounted on the holder and located at a side of the filter facing away from the photosensitive chip. A dustproof layer is laid on the surface of the circuit board facing the filter and surrounds the photosensitive chip. An electronic device having the camera module is also provided.