Invention Grant
- Patent Title: Slice information processing method and apparatus
-
Application No.: US17201916Application Date: 2021-03-15
-
Publication No.: US11778544B2Publication Date: 2023-10-03
- Inventor: Yang Xin , Xiaobo Wu , Weiwei Chong , Fangyuan Zhu , Clarissa Marquezan
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Fish & Richardson P.C.
- Priority: CN 1811142739.0 2018.09.28
- Main IPC: H04W28/02
- IPC: H04W28/02 ; H04L41/342 ; H04W48/14

Abstract:
The present disclosure relates to slice information processing methods. One example method includes sending, by a management and control function network element, a first request to a data analytics function network element, where the first request requests first information of a slice network including at least one slice, and the first request includes identity information of the at least one slice, and receiving, by the management and control function network element, a first response from the data analytics function network element, where the first response includes the first information, and the first information is used for at least one of user control or application control of each slice of the at least one slice.
Public/Granted literature
- US20210204198A1 SLICE INFORMATION PROCESSING METHOD AND APPARATUS Public/Granted day:2021-07-01
Information query