Invention Grant
- Patent Title: Heat resistant polyamide composition
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Application No.: US16649124Application Date: 2018-09-20
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Publication No.: US11781015B2Publication Date: 2023-10-10
- Inventor: Gijsbrecht Jacobus Maria Habraken , Patrick Spies
- Applicant: BASF SE
- Applicant Address: DE Lugwigshafen am Rhein
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen am Rhein
- Agency: DLA Piper LLP (US)
- International Application: PCT/EP2018/075531 2018.09.20
- International Announcement: WO2019/057849A 2019.03.28
- Date entered country: 2020-03-19
- Main IPC: C08L77/08
- IPC: C08L77/08 ; C08K3/04 ; C08K5/17 ; C08L23/06 ; C08L23/12 ; C08L23/18 ; C08L51/06 ; C08L77/02
Abstract:
A heat-resistant polyamide composition includes a copolyamide and an anhydride-functional polymer. The copolyamide includes the reaction product of at least one lactam and a monomer mixture. The monomer mixture includes at least one C32-C40 dimer acid, and at least one C4-C12-diamine.
Public/Granted literature
- US20200291230A1 HEAT RESISTANT POLYAMIDE COMPOSITION Public/Granted day:2020-09-17
Information query
