Invention Grant
- Patent Title: Force sensor including multiple array substrates
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Application No.: US17467757Application Date: 2021-09-07
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Publication No.: US11781925B2Publication Date: 2023-10-10
- Inventor: Hiroumi Kinjo
- Applicant: Japan Display Inc.
- Applicant Address: JP Tokyo
- Assignee: Japan Display Inc.
- Current Assignee: Japan Display Inc.
- Current Assignee Address: JP Tokyo
- Agency: Maier & Maier, PLLC
- Priority: JP 20155746 2020.09.16
- Main IPC: G01L1/14
- IPC: G01L1/14 ; H01L25/065

Abstract:
A force sensor including an array layer that includes array substrates arranged on an identical plane such that end portions thereof are adjacent to each other, the force sensor includes
the array layer having a first surface on which array electrodes are disposed and a second surface opposite to the first surface;
a conductive layer layered on the first surface of the array layer;
a protection layer layered on the conductive layer; and
a counter electrode interposed between the conductive layer and the protection layer, wherein
a bonding member which bonds the adjacent array substrates and covers a joint between the adjacent array substrates is provided on the second surface of the array layer,
the conductive layer is composed of a single member layered across each of the array substrates, and
a sealing portion having a frame shape is provided on an outer circumference side of the conductive layer.
the array layer having a first surface on which array electrodes are disposed and a second surface opposite to the first surface;
a conductive layer layered on the first surface of the array layer;
a protection layer layered on the conductive layer; and
a counter electrode interposed between the conductive layer and the protection layer, wherein
a bonding member which bonds the adjacent array substrates and covers a joint between the adjacent array substrates is provided on the second surface of the array layer,
the conductive layer is composed of a single member layered across each of the array substrates, and
a sealing portion having a frame shape is provided on an outer circumference side of the conductive layer.
Public/Granted literature
- US20220082457A1 FORCE SENSOR Public/Granted day:2022-03-17
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