Invention Grant
- Patent Title: Coil component
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Application No.: US16986567Application Date: 2020-08-06
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Publication No.: US11783982B2Publication Date: 2023-10-10
- Inventor: Hwi Dae Kim , Dong Hwan Lee , Sang Soo Park , Chan Yoon , Dong Jin Lee , Hye Mi Yoo
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20200062334 2020.05.25
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01F17/04 ; H01F27/29 ; H01F27/32

Abstract:
A coil component includes a body; a coil portion disposed inside the body; a noise removal portion disposed to contact a surface of the body; an insulating layer disposed inside the noise removal portion; first and second external electrodes each connected to the coil portion and disposed on the insulating layer to overlap the noise removal portion; and a third external electrode disposed to be spaced apart from the first and second external electrodes and contacting the noise removal portion.
Public/Granted literature
- US20210366640A1 COIL COMPONENT Public/Granted day:2021-11-25
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |