- 专利标题： Component carrier having dielectric layer with conductively filled through holes tapering in opposite directions
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申请号： US17444266申请日： 2021-08-02
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公开(公告)号： US11784115B2公开(公告)日： 2023-10-10
- 发明人: Roland Wilfing
- 申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- 申请人地址： AT Leoben
- 专利权人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- 当前专利权人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- 当前专利权人地址： AT Leoben
- 代理机构： Smith Tempel Blaha LLC
- 代理商 Robert A. Blaha
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K1/11 ; H01L23/498 ; H01L21/48
摘要：
A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure. At least one electrically insulating layer structure has at least partly tapering through holes filled substantially completely with an electrically conductive filling. The at least one electrically conductive layer structure and the electrically conductive filling are made of the same material. In addition, different ones of the through holes of one electrically insulating layer structure are tapering in opposite directions.
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