- Patent Title: Semiconductor device package and method for manufacturing the same
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Application No.: US17347215Application Date: 2021-06-14
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Publication No.: US11784152B2Publication Date: 2023-10-10
- Inventor: Ming Hsien Chu , Chi-Yu Wang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L23/48 ; H01L23/52 ; H01L23/00 ; H01L23/498 ; H01L23/31 ; H01L23/66 ; H01L21/683 ; H01L21/56 ; H01L21/48

Abstract:
A semiconductor device package includes a first electronic device and a second electronic device. The first electronic device includes a first redistribution layer (RDL) including a circuit layer. The second electronic device is disposed on the first RDL of the first electronic device. The second electronic device includes an encapsulant and a patterned conductive layer. The encapsulant has a first surface facing the first RDL of the first electronic device, and a second surface opposite to the first surface. The patterned conductive layer is disposed at the second surface of the encapsulant, and is configured to be electrically coupled to the circuit layer of the first RDL of the first electronic device.
Public/Granted literature
- US20210305192A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2021-09-30
Information query
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