- 专利标题: Semiconductor devices with bent portions
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申请号: US17119507申请日: 2020-12-11
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公开(公告)号: US11784255B2公开(公告)日: 2023-10-10
- 发明人: Hyun-Kwan Yu , Sung-Min Kim , Dong-Suk Shin , Seung-Hun Lee , Dong-Won Kim
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Myers Bigel, P.A.
- 优先权: KR 20170116803 2017.09.12
- 主分类号: H01L29/06
- IPC分类号: H01L29/06 ; H01L29/78 ; H01L29/66 ; H01L27/088 ; H01L21/8234 ; H01L29/423 ; H10B10/00 ; H01L21/8238 ; H01L21/84 ; H01L27/12 ; H01L27/092
摘要:
A semiconductor device may include a first active fin, a second active fin and a gate structure. The first active fin may extend in a first direction on a substrate and may include a first straight line extension portion, a second straight line extension portion, and a bent portion between the first and second straight line extension portions. The second active fin may extend in the first direction on the substrate. The gate structure may extend in a second direction perpendicular to the first direction on the substrate. The gate structure may cross one of the first and second straight line extension portions of the first active fin and may cross the second active fin.
公开/授权文献
- US20210119036A1 SEMICONDUCTOR DEVICES WITH BENT PORTIONS 公开/授权日:2021-04-22
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