Invention Grant
- Patent Title: Semiconductor devices with bent portions
-
Application No.: US17119507Application Date: 2020-12-11
-
Publication No.: US11784255B2Publication Date: 2023-10-10
- Inventor: Hyun-Kwan Yu , Sung-Min Kim , Dong-Suk Shin , Seung-Hun Lee , Dong-Won Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR 20170116803 2017.09.12
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/78 ; H01L29/66 ; H01L27/088 ; H01L21/8234 ; H01L29/423 ; H10B10/00 ; H01L21/8238 ; H01L21/84 ; H01L27/12 ; H01L27/092

Abstract:
A semiconductor device may include a first active fin, a second active fin and a gate structure. The first active fin may extend in a first direction on a substrate and may include a first straight line extension portion, a second straight line extension portion, and a bent portion between the first and second straight line extension portions. The second active fin may extend in the first direction on the substrate. The gate structure may extend in a second direction perpendicular to the first direction on the substrate. The gate structure may cross one of the first and second straight line extension portions of the first active fin and may cross the second active fin.
Public/Granted literature
- US20210119036A1 SEMICONDUCTOR DEVICES WITH BENT PORTIONS Public/Granted day:2021-04-22
Information query
IPC分类: