Invention Grant
- Patent Title: AGC aspects of sidelink DMRS bundling
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Application No.: US17355014Application Date: 2021-06-22
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Publication No.: US11784769B2Publication Date: 2023-10-10
- Inventor: Xiaojie Wang , Xiaoxia Zhang , Jing Sun , Piyush Gupta , Junyi Li , Peter Gaal , Sony Akkarakaran , Jung Ho Ryu , Tao Luo
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Main IPC: H04W4/00
- IPC: H04W4/00 ; H04L5/00 ; H04W72/0446 ; H04W72/20

Abstract:
A first UE may select, based on a resource pool configuration for a sidelink communication, at least one of a first slot in time or a second slot in time of a plurality of slots. The plurality of slots may be associated with DMRS bundling. The first UE may configure, based on the DMRS bundling, at least one of one or more symbols in the first slot in time from a gap symbol to a non-gap symbol or one or more symbols in the second slot in time from an AGC symbol to a non-AGC symbol. The first UE may transmit, to a second UE, an indication of the configuration of the at least one of the one or more symbols in the first slot in time or the one or more symbols in the second slot in time.
Public/Granted literature
- US20220407645A1 AGC ASPECTS OF SIDELINK DMRS BUNDLING Public/Granted day:2022-12-22
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