- 专利标题: Cover for pressing a printed-circuit board on a heat sink
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申请号: US17389550申请日: 2021-07-30
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公开(公告)号: US11785704B2公开(公告)日: 2023-10-10
- 发明人: Hans-Juergen Regl , Alexander Mieslinger
- 申请人: HARMAN BECKER AUTOMOTIVE SYSTEMS GmbH
- 申请人地址: DE Karlsbad-Ittersbach
- 专利权人: Harman Becker Automotive Systems GMBH
- 当前专利权人: Harman Becker Automotive Systems GMBH
- 当前专利权人地址: DE Karlsbad-Ittersbach
- 代理机构: Artegis Law Group, LLP
- 优先权: DE 2020120326.8 2020.07.31
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H05K3/00
摘要:
Provided is a cover for pressing a printed circuit board on a heat sink, the cover comprising a metal sheet and one or more domes arranged in the metal sheet, wherein each dome is associated with one or more slits in the shape of ring segments in the metal sheet, the ring segment-shaped slits being provided in the metal sheet side by side and spaced apart from each other, the ring segment-shaped slits surrounding the dome they are associated with. At least at one end of each ring segment-shaped slit a slit extension may be provided in the metal sheet, the slit extension at least in part pointing away from the dome the ring segment-shaped slit is associated with. Further provided is an electronic appliance that includes such a cover, a heat sink and an electronic circuit board sandwiched there between.
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