Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US17659881Application Date: 2022-04-20
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Publication No.: US11785774B2Publication Date: 2023-10-10
- Inventor: Keiichi Sawa , Kazuhiro Matsuo , Kazuhisa Matsuda , Hiroyuki Yamashita , Yuta Saito , Shinji Mori , Masayuki Tanaka , Kenichiro Toratani , Atsushi Takahashi , Shouji Honda
- Applicant: KIOXIA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: KIOXIA CORPORATION
- Current Assignee: KIOXIA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP 19048973 2019.03.15
- The original application number of the division: US17136621 2020.12.29
- Main IPC: H10B43/27
- IPC: H10B43/27 ; H10B41/10 ; H01L29/792 ; H10B43/20 ; H10B43/35

Abstract:
In one embodiment, a semiconductor device includes a substrate, insulating films and first films alternately stacked on the substrate, at least one of the first films including an electrode layer and a charge storage layer provided on a face of the electrode layer via a first insulator, and a semiconductor layer provided on a face of the charge storage layer via a second insulator. The device further includes at least one of a first portion including nitrogen and provided between the first insulator and the charge storage layer with an air gap provided in the first insulator, a second portion including nitrogen, provided between the charge storage layer and the second insulator, and including a portion protruding toward the charge storage layer, and a third portion including nitrogen and provided between the second insulator and the semiconductor layer with an air gap provided in the first insulator.
Public/Granted literature
- US20220246640A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-08-04
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