Invention Grant
- Patent Title: Molding method, molding apparatus, molding system, and article manufacturing method
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Application No.: US17487307Application Date: 2021-09-28
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Publication No.: US11787092B2Publication Date: 2023-10-17
- Inventor: Hiroshi Sato
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: ROSSI, KIMMS & McDOWELL LLP
- Priority: JP 20180839 2020.10.28
- Main IPC: C23F1/00
- IPC: C23F1/00 ; B29C43/58 ; B29C43/20

Abstract:
The present invention provides a molding method of molding, using a mold, an uncured composition arranged on a substrate as a film continuously covering a surface of the substrate, including obtaining unevenness information concerning an unevenness of a surface of an uncured first composition arranged as the film on the substrate, arranging a droplet of an uncured second composition on a concave portion of the surface of the first composition based on the unevenness information obtained in the obtaining, and after the arranging the droplet is performed, molding a composition including the film of the first composition and the droplet of the second composition by the mold.
Public/Granted literature
- US20220126488A1 MOLDING METHOD, MOLDING APPARATUS, MOLDING SYSTEM, AND ARTICLE MANUFACTURING METHOD Public/Granted day:2022-04-28
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