Invention Grant
- Patent Title: Print component with memory circuit
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Application No.: US17884329Application Date: 2022-08-09
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Publication No.: US11787173B2Publication Date: 2023-10-17
- Inventor: Boon Bing Ng , James Michael Gardner
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Foley & Lardner LLP
- Main IPC: B41J2/045
- IPC: B41J2/045

Abstract:
A memory circuit for a print component including a plurality of I/O pads, including an analog pad, to connect to a plurality of signals paths which communicate operating signals to the print component, and a memory component to store memory values associated with the print component. A control circuit to, in response to identifying a sequence of operating signals representing a memory read, provide a first analog signal on the analog pad in parallel with a second analog signal from the print component to provide an analog electrical value on the analog pad representing stored memory values selected by the memory read.
Public/Granted literature
- US20220379602A1 PRINT COMPONENT WITH MEMORY CIRCUIT Public/Granted day:2022-12-01
Information query
IPC分类: