Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
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Application No.: US17547526Application Date: 2021-12-10
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Publication No.: US11787183B2Publication Date: 2023-10-17
- Inventor: Hiroaki Okui , Eiichiro Watanabe , Shun Katsuie
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP 20205637 2020.12.11
- Main IPC: B41J2/155
- IPC: B41J2/155 ; B41J2/14

Abstract:
A head includes an upper surface opposite from an ejection surface; and an electrical coupling portion disposed at a first-end portion of the upper surface in a Y-direction, an outer shape of the upper surface has first and second edges separated from each other in an X-direction, a third-edge disposed at the first-end portion, and a fourth-edge disposed at a second-end portion opposite from the first-end portion in the Y-direction, along a V-direction, and when viewed in a normal direction, the upper surface is not overlapped with an acute-angled portion of a virtual parallelogram having a first-virtual side contacting the first-edge, a second-virtual side contacting the second-edge, a third-virtual side contacting the third-edge, and a fourth-virtual side contacting the fourth-edge, and projects beyond an obtuse-angled portion of the virtual parallelogram in the X-direction.
Public/Granted literature
- US20220184956A1 Liquid Ejecting Head And Liquid Ejecting Apparatus Public/Granted day:2022-06-16
Information query
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