Invention Grant
- Patent Title: Three-dimensional (3D) printing
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Application No.: US17837291Application Date: 2022-06-10
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Publication No.: US11787938B2Publication Date: 2023-10-17
- Inventor: Carolin Fleischmann , Rachael Donovan , Shannon Reuben Woodruff , Yi Feng
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- The original application number of the division: US16490917
- Main IPC: B29C64/165
- IPC: B29C64/165 ; C08L77/04 ; B33Y10/00 ; B33Y70/00 ; C09D11/102 ; C09D11/30 ; B29K77/00

Abstract:
Compositions including polyamides and methods of employing compositions including polyamides are described herein. For instance, composition for three-dimensional (3D) printing can include a polymer build material comprising of at least two polyamides including a first polyamide and a second polyamide, where the first polyamide is present in an amount ranging of from about 95% to about 99% of a total weight of the polymer build material and where the second polyamide is present in an amount ranging of from about 1% to about 5% of the total weight of the polymer build material.
Public/Granted literature
- US20220298369A1 THREE-DIMENSIONAL (3D) PRINTING Public/Granted day:2022-09-22
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