- Patent Title: Chip heat dissipation structure and liquid crystal display device
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Application No.: US16972622Application Date: 2020-10-30
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Publication No.: US11789199B2Publication Date: 2023-10-17
- Inventor: Zheng Zhou , Suimang Song
- Applicant: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Wuhan
- Assignee: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Wuhan
- Priority: CN 2011138491.8 2020.10.22
- International Application: PCT/CN2020/125292 2020.10.30
- International Announcement: WO2022/082849A 2022.04.28
- Date entered country: 2020-12-07
- Main IPC: F21V8/00
- IPC: F21V8/00 ; H05K7/20 ; G02F1/1335 ; G02F1/1333

Abstract:
The present invention discloses a chip heat dissipation structure and a liquid crystal display device, and the chip heat dissipation structure includes: a chip contact end and a backplate contact end. The chip heat dissipation structure is made of thermal conductive material. The backplate is a backplate on a bottom of a backlight module in the liquid crystal display device. The present invention by conducting heat generated by the chip to the backplate lowers the increased temperature of the chip to solve the issue the heated surface of the liquid crystal display device.
Public/Granted literature
- US20220317363A1 CHIP HEAT DISSIPATION STRUCTURE AND LIQUID CRYSTAL DISPLAY DEVICE Public/Granted day:2022-10-06
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