Chip heat dissipation structure and liquid crystal display device
Abstract:
The present invention discloses a chip heat dissipation structure and a liquid crystal display device, and the chip heat dissipation structure includes: a chip contact end and a backplate contact end. The chip heat dissipation structure is made of thermal conductive material. The backplate is a backplate on a bottom of a backlight module in the liquid crystal display device. The present invention by conducting heat generated by the chip to the backplate lowers the increased temperature of the chip to solve the issue the heated surface of the liquid crystal display device.
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