- Patent Title: Detecting defects in semiconductor specimens using weak labeling
-
Application No.: US17751507Application Date: 2022-05-23
-
Publication No.: US11790515B2Publication Date: 2023-10-17
- Inventor: Irad Peleg , Ran Schleyen , Boaz Cohen
- Applicant: Applied Materials Israel Ltd.
- Applicant Address: IL Rehovot
- Assignee: Applied Materials Israel Ltd.
- Current Assignee: Applied Materials Israel Ltd.
- Current Assignee Address: IL Rehovot
- Agency: Lowenstein Sandler LLP
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G06T7/11 ; G06F18/22 ; G06F18/214 ; G06V10/82 ; G06V10/44 ; G06V20/69 ; G01N21/95 ; G06N3/06

Abstract:
A system for classifying a pattern of interest (POI) on a semiconductor specimen is disclosed. The system comprises a processor and memory circuitry. The memory circuitry is configured to obtain a high-resolution image of the POI, and to generate data usable for classifying the POI in accordance with a defectiveness-related classification. To generate the data, a machine learning model is utilized that has been trained in accordance with training samples. The training samples include a high-resolution training image captured by scanning a respective training pattern on a specimen, the respective training pattern being similar to the POI. The training samples also include a label associated with the image, the label being derivative of low-resolution inspection of the respective training pattern.
Public/Granted literature
- US20220301151A1 DETECTING DEFECTS IN SEMICONDUCTOR SPECIMENS USING WEAK LABELING Public/Granted day:2022-09-22
Information query