Some example embodiments relate to a semiconductor device and a semiconductor package. The semiconductor package includes a substrate including a conductive layer, an insulating layer coating the substrate, the insulating layer including an opening exposing at least part of the conductive layer, and an under-bump metal layer electrically connected to the at least part of the conductive layer exposed through the opening, wherein the insulating layer includes at least one recess adjacent to the opening, and the under-bump metal layer fills the at least one recess. The semiconductor device and the semiconductor package may have improved drop test characteristics and impact resistance.