Invention Grant
- Patent Title: Array substrate and manufacturing method thereof
-
Application No.: US17045186Application Date: 2020-06-05
-
Publication No.: US11791351B2Publication Date: 2023-10-17
- Inventor: Zhiwei Tan
- Applicant: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- Priority: CN 2010286731.2 2020.04.13
- International Application: PCT/CN2020/094686 2020.06.05
- International Announcement: WO2021/208215A 2021.10.21
- Date entered country: 2020-10-05
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/00 ; H01L29/00 ; H01L27/12 ; H01L21/306 ; H01L21/308 ; H01L21/3213 ; H01L29/786

Abstract:
The present disclosure provides an array substrate and a manufacturing method of the array substrate. In the manufacturing method of the array substrate, during performing a first wet etching and a second wet etching on a second metal layer, the wet etching is stopped when a copper conductive layer is merely etched completely. Because a wet etching speed of a liner layer is slow, an etching time of the wet etching and a CD loss of the copper conductive layer can be greatly reduced, and the CD loss is relatively small. Meanwhile, an entire CD loss of the second metal layer can be reduced, and an aperture ratio can be improved.
Public/Granted literature
- US20230122931A1 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2023-04-20
Information query
IPC分类: