Invention Grant
- Patent Title: Light-emitting device and element mounting wiring board
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Application No.: US17736764Application Date: 2022-05-04
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Publication No.: US11791448B2Publication Date: 2023-10-17
- Inventor: Atsushi Kojima , Kenji Ozeki , Chinami Nakai
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Foley & Lardner LLP
- Priority: JP 19136676 2019.07.25
- The original application number of the division: US16928233 2020.07.14
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/00 ; H01L33/56 ; H01L33/48 ; H01L33/60

Abstract:
A light-emitting device includes: a light-emitting element; a wiring board that includes: a substrate, and a wiring pattern including: a plating base layer disposed on the substrate so as to have a gap portion that surrounds a first region in which the light-emitting element is mounted, and a plating layer having a groove that surrounds the first region; a first covering member, at least a portion of which is located in the groove and includes: a reflective material containing layer that contains a first reflective material, and a light-transmissive layer formed above the reflective material containing layer; and a light-transmissive member disposed on the first covering member and the light-emitting element.
Public/Granted literature
- US20220263003A1 LIGHT-EMITTING DEVICE AND ELEMENT MOUNTING WIRING BOARD Public/Granted day:2022-08-18
Information query
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