Invention Grant
- Patent Title: Radio-frequency module and communication apparatus
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Application No.: US17376167Application Date: 2021-07-15
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Publication No.: US11791853B2Publication Date: 2023-10-17
- Inventor: Shigeru Tsuchida , Hiroki Shonai , Masakazu Tani , Yukiya Yamaguchi , Morio Takeuchi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo
- Agency: XSENSUS LLP
- Priority: JP 20122416 2020.07.16
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H04B1/16

Abstract:
A radio-frequency module includes a mounting substrate having a first main surface; a first power amplifier that is mounted on the first main surface and that amplifies a first transmission signal in a first frequency band; a second power amplifier that is mounted on the first main surface and that amplifies a second transmission signal in a second frequency band different from the first frequency band; a first output matching circuit that is mounted on the first main surface and that receives the first transmission signal amplified by the first power amplifier; and a second output matching circuit that is mounted on the first main surface and that receives the second transmission signal amplified by the second power amplifier. The first output matching circuit and the second output matching circuit are mounted along a second direction intersecting with the first direction.
Public/Granted literature
- US20220021407A1 RADIO-FREQUENCY MODULE AND COMMUNICATION APPARATUS Public/Granted day:2022-01-20
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