Invention Grant
- Patent Title: Device including a circuit member sealed by a film, and method of forming the device
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Application No.: US17499002Application Date: 2021-10-12
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Publication No.: US11792949B2Publication Date: 2023-10-17
- Inventor: Shinji Ueda , Osamu Hashiguchi
- Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Applicant Address: JP Tokyo
- Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JP 20205499 2020.12.11
- Main IPC: H05K5/06
- IPC: H05K5/06 ; H05K1/11

Abstract:
A device includes a first sealing member including a first film, a second sealing member, a first circuit member including a first contact point, and a second circuit member including a second contact point. The device defines a closed space which is enclosed by the first sealing member and the second sealing member and is shut off from an outer space outside the device. The first circuit member and the second circuit member are shut in the closed space. At least one of the first sealing member and the second sealing member includes an uneven portion. The uneven portion is in contact with at least one of the first circuit member and the second circuit member and covers a predetermined region which corresponds to at least one of the first contact point and the second contact point.
Public/Granted literature
- US20220192043A1 DEVICE AND FORMING METHOD OF DEVICE Public/Granted day:2022-06-16
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