Invention Grant
- Patent Title: Preventing gate-to-contact bridging by reducing contact dimensions in FinFET SRAM
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Application No.: US16046188Application Date: 2018-07-26
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Publication No.: US11792969B2Publication Date: 2023-10-17
- Inventor: Shih-Han Huang , Chih-Hung Hsieh
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: HAYNES AND BOONE, LLP
- The original application number of the division: US15636832 2017.06.29
- Main IPC: H01L27/11
- IPC: H01L27/11 ; H01L27/02 ; G06F30/392 ; H01L29/417 ; H01L21/8238 ; H10B10/00

Abstract:
A static random access memory (SRAM) cell includes a first gate and a second gate each extending in a first direction. A first gap separates the first gate from the second gate in the first direction. The SRAM cell includes a Vcc contact extending in the first direction. A second gap separates the Vcc contact and the first gate in a second direction perpendicular to the first direction. No segment of the Vcc contact overlaps with the first gap in the first direction. The SRAM cell includes a Vss contact extending in the first direction. A third gap separates the Vss contact from the first gate in the second direction. A segment of the Vss contact is disposed to the first gap. The Vss contact is smaller than the Vcc contact in the second direction.
Public/Granted literature
- US20190006373A1 PREVENTING GATE-TO-CONTACT BRIDGING BY REDUCING CONTACT DIMENSIONS IN FINFET SRAM Public/Granted day:2019-01-03
Information query
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