• Patent Title: Assembling die block and assembling apparatus using the same
  • Application No.: US17476490
    Application Date: 2021-09-16
  • Publication No.: US11794292B2
    Publication Date: 2023-10-24
  • Inventor: Ting-Jui Wang
  • Applicant: Ting-Jui Wang
  • Applicant Address: TW New Taipei
  • Assignee: Ting-Jui Wang
  • Current Assignee: Ting-Jui Wang
  • Current Assignee Address: TW New Taipei
  • Priority: TW 9136977 2020.10.23 TW 0111339 2021.03.29
  • Main IPC: B23P19/02
  • IPC: B23P19/02
Assembling die block and assembling apparatus using the same
Abstract:
An assembling die block includes a first main die having at least one first mounting section; a second main die having at least one second mounting section; at least one first matching die respectively having a first mating section to be correspondingly associated with the at least one first mounting section; and at least one second matching die respectively having a second mating section to be correspondingly associated with the at least one second mounting section. Wherein, there is a plurality of first mounting sections arrayed in a matrix; or there is a plurality of second mounting sections arrayed in a matrix; or there is a plurality of first mounting sections arrayed in a matrix and a plurality of second mounting sections arrayed in a matrix. An assembling apparatus using the above assembling die block is also disclosed.
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