Invention Grant
- Patent Title: Assembling die block and assembling apparatus using the same
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Application No.: US17476490Application Date: 2021-09-16
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Publication No.: US11794292B2Publication Date: 2023-10-24
- Inventor: Ting-Jui Wang
- Applicant: Ting-Jui Wang
- Applicant Address: TW New Taipei
- Assignee: Ting-Jui Wang
- Current Assignee: Ting-Jui Wang
- Current Assignee Address: TW New Taipei
- Priority: TW 9136977 2020.10.23 TW 0111339 2021.03.29
- Main IPC: B23P19/02
- IPC: B23P19/02

Abstract:
An assembling die block includes a first main die having at least one first mounting section; a second main die having at least one second mounting section; at least one first matching die respectively having a first mating section to be correspondingly associated with the at least one first mounting section; and at least one second matching die respectively having a second mating section to be correspondingly associated with the at least one second mounting section. Wherein, there is a plurality of first mounting sections arrayed in a matrix; or there is a plurality of second mounting sections arrayed in a matrix; or there is a plurality of first mounting sections arrayed in a matrix and a plurality of second mounting sections arrayed in a matrix. An assembling apparatus using the above assembling die block is also disclosed.
Public/Granted literature
- US20220126407A1 ASSEMBLING DIE BLOCK AND ASSEMBLING APPARATUS USING THE SAME Public/Granted day:2022-04-28
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