Invention Grant
- Patent Title: Array substrate comprising a first metal layer electrically connected to a first doped area through a bridge layer and display panel
-
Application No.: US17600321Application Date: 2021-08-19
-
Publication No.: US11796847B2Publication Date: 2023-10-24
- Inventor: Yong Xu , Fei Ai
- Applicant: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Hubei
- Assignee: Wuhan China Star Optoelectronics Technology Co., Ltd.
- Current Assignee: Wuhan China Star Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Hubei
- Agency: PV IP PC
- Agent Zhigang Ma; Wei Te Chung
- Priority: CN 2110828079.7 2021.07.22
- International Application: PCT/CN2021/113410 2021.08.19
- International Announcement: WO2023/000422A 2023.01.26
- Date entered country: 2021-09-30
- Main IPC: G02F1/1333
- IPC: G02F1/1333 ; G02F1/1362 ; G02F1/1343 ; H01L27/12 ; H01L29/786 ; H01L29/66

Abstract:
An array substrate, includes: a substrate, a first metal layer, a first buffer layer, and an active layer, a gate insulating layer, a second metal layer, a first insulating layer, a third metal layer and a first planarization layer. The first metal layer is electrically connected with the first doped area of the active layer through the bridge layer of the second metal layer. The third metal layer is electrically connected with the second doped area of the active layer. The array substrate of the present disclosure reduces a size of a thin film transistor by stacking the first metal layer, the second metal layer, and the third metal layer, thereby increasing pixel density. A display panel is also provided.
Public/Granted literature
- US20230028565A1 ARRAY SUBSTRATE AND DISPLAY PANEL Public/Granted day:2023-01-26
Information query
IPC分类: