- 专利标题： Electromagnetic relay
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申请号： US16518719申请日： 2019-07-22
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公开(公告)号： US11798765B2公开(公告)日： 2023-10-24
- 发明人: Koyuru Kobayashi , Kazuaki Miyanaga , Katsuyuki Takahashi , Masahide Mochizuki , Shigeki Nakayama , Natsumi Sakai , Hiroaki Kohinata , Daishi Kitajima , Satoshi Matsumoto
- 申请人： Fujitsu Component Limited
- 申请人地址： JP Tokyo
- 专利权人： FUJITSU COMPONENT LIMITED
- 当前专利权人： FUJITSU COMPONENT LIMITED
- 当前专利权人地址： JP Tokyo
- 代理机构： Shumaker & Sieffert, P.A.
- 优先权： JP 18143628 2018.07.31
- 主分类号： H01H50/02
- IPC分类号： H01H50/02 ; H01H51/29
摘要：
An electromagnetic relay including a housing, a cover, an adhesive which is interposed between a side part of the housing and an inner surface of the cover and which secures the housing and the cover, and a projection which is formed in at least one of the side part and the inner surface. The adhesive is filled in a gap between the side part and the inner surface.
公开/授权文献
- US20200043687A1 ELECTROMAGNETIC RELAY 公开/授权日：2020-02-06
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