Invention Grant
- Patent Title: Electromagnetic relay
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Application No.: US16518719Application Date: 2019-07-22
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Publication No.: US11798765B2Publication Date: 2023-10-24
- Inventor: Koyuru Kobayashi , Kazuaki Miyanaga , Katsuyuki Takahashi , Masahide Mochizuki , Shigeki Nakayama , Natsumi Sakai , Hiroaki Kohinata , Daishi Kitajima , Satoshi Matsumoto
- Applicant: Fujitsu Component Limited
- Applicant Address: JP Tokyo
- Assignee: FUJITSU COMPONENT LIMITED
- Current Assignee: FUJITSU COMPONENT LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Shumaker & Sieffert, P.A.
- Priority: JP 18143628 2018.07.31
- Main IPC: H01H50/02
- IPC: H01H50/02 ; H01H51/29
Abstract:
An electromagnetic relay including a housing, a cover, an adhesive which is interposed between a side part of the housing and an inner surface of the cover and which secures the housing and the cover, and a projection which is formed in at least one of the side part and the inner surface. The adhesive is filled in a gap between the side part and the inner surface.
Public/Granted literature
- US20200043687A1 ELECTROMAGNETIC RELAY Public/Granted day:2020-02-06
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