Invention Grant
- Patent Title: Cyclical deposition method and apparatus for filling a recess formed within a substrate surface
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Application No.: US17741562Application Date: 2022-05-11
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Publication No.: US11798834B2Publication Date: 2023-10-24
- Inventor: Zecheng Liu , Viljami Pore
- Applicant: ASM IP Holding B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP Holding B.V.
- Current Assignee: ASM IP Holding B.V.
- Current Assignee Address: NL Almere
- Agency: Shell & Wilmer L.LP.
- Main IPC: H01L21/762
- IPC: H01L21/762 ; C23C16/04 ; H01L21/02 ; C23C16/455
Abstract:
There is provided a method of filling one or more recesses by providing the substrate in a reaction chamber; introducing a first reactant, to form first active species, for a first pulse time to the substrate; introducing a second reactant for a second pulse time to the substrate; and introducing a third reactant, to form second active species, for a third pulse time to the substrate. An apparatus for filling a recess is also disclosed and a structure formed using the method and/or apparatus is disclosed.
Public/Granted literature
- US20220270917A1 CYCLICAL DEPOSITION METHOD AND APPARATUS FOR FILLING A RECESS FORMED WITHIN A SUBSTRATE SURFACE Public/Granted day:2022-08-25
Information query
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