Invention Grant
- Patent Title: Fluidic flow channel over active surface of a die
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Application No.: US17820659Application Date: 2022-08-18
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Publication No.: US11798854B2Publication Date: 2023-10-24
- Inventor: Arvin Emadi , Arnaud Rival , Ali Agah , Tara Bozorg-Grayeli
- Applicant: Illumina, Inc.
- Applicant Address: US CA San Diego
- Assignee: Illumina, Inc.
- Current Assignee: Illumina, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Heslin Rothenberg Farley & Mesiti P.C
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/053 ; H01L23/00 ; H01L23/48 ; B81B1/00 ; H01L23/15 ; G01N21/64

Abstract:
Provided herein include various examples of an apparatus, a sensor system and examples of a method for manufacturing aspects of an apparatus, a sensor system. The apparatus may include a die. The apparatus may also include a substrate comprising a cavity. The die may be oriented in a portion of the cavity in the substrate, where the orientation defines a first space in the cavity adjacent to a first edge of the upper surface of the die and a second space in the cavity adjacent to the second edge of the upper surface of the die. The apparatus may further include fluidics fan-out regions comprising a first cured material deposited in the first space and the second space, a surface of the fluidics fan-out regions being contiguous with the upper surface of the die.
Public/Granted literature
- US20220415731A1 FLUIDIC FLOW CHANNEL OVER ACTIVE SURFACE OF A DIE Public/Granted day:2022-12-29
Information query
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