Invention Grant
- Patent Title: Methods of forming microvias with reduced diameter
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Application No.: US17725003Application Date: 2022-04-20
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Publication No.: US11798903B2Publication Date: 2023-10-24
- Inventor: Chintan Buch , Roman Gouk , Steven Verhaverbeke
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A method for forming microvias for packaging applications is disclosed. A sacrificial photosensitive material is developed to form microvias with reduced diameter and improved placement accuracy. The microvias are filled with a conductive material and the surrounding dielectric is removed and replaced with an RDL polymer layer.
Public/Granted literature
- US20220246558A1 Methods Of Forming Microvias With Reduced Diameter Public/Granted day:2022-08-04
Information query
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