- 专利标题： Integrated circuit including ESD protection modules
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申请号： US17321063申请日： 2021-05-14
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公开(公告)号： US11798934B2公开(公告)日： 2023-10-24
- 发明人: Hongquan Sun , Wangsheng Xie
- 申请人： Huawei Technologies Co., Ltd.
- 申请人地址： CN Shenzhen
- 专利权人： Huawei Technologies Co., Ltd.
- 当前专利权人： Huawei Technologies Co., Ltd.
- 当前专利权人地址： CN Shenzhen
- 代理机构： Leydig, Voit & Mayer, Ltd.
- 主分类号： H01L27/02
- IPC分类号： H01L27/02 ; H01L23/528 ; H01L25/065 ; H01L25/18 ; H01L27/10
摘要：
This application discloses an integrated circuit, and relates to the field of electronic technologies, to ensure that the integrated circuit has a relatively high bandwidth and can meet an ESD standard. The integrated circuit includes a die and a transmission line coupled to the die. Electrostatic discharge ESD modules are periodically disposed on the transmission line.
公开/授权文献
- US20210272948A1 INTEGRATED CIRCUIT INCLUDING ESD PROTECTION MODULES 公开/授权日：2021-09-02
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