Invention Grant
- Patent Title: Scalable system on a chip
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Application No.: US17821312Application Date: 2022-08-22
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Publication No.: US11803471B2Publication Date: 2023-10-31
- Inventor: Per H. Hammarlund , Lior Zimet , Sergio Kolor , Sagi Lahav , James Vash , Gaurav Garg , Tal Kuzi , Jeffry E. Gonion , Charles E. Tucker , Lital Levy-Rubin , Dany Davidov , Steven Fishwick , Nir Leshem , Mark Pilip , Gerard R. Williams, III , Harshavardhan Kaushikkar , Srinivasa Rangan Sridharan
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kowert, Hood, Munyon, Rankin & Goetzel, P.C.
- Main IPC: G06F12/08
- IPC: G06F12/08 ; G06F12/0831 ; G06F12/128 ; G06F12/0811 ; G06F12/0815 ; G06F12/109 ; G06F13/28 ; G06F13/16 ; G06F13/40 ; G06F15/173 ; G06F15/78

Abstract:
An integrated circuit (IC) including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture. For example, the IC may include an interconnect fabric configured to provide communication between the one or more memory controller circuits and the processor cores, graphics processing units, and peripheral devices; and an off-chip interconnect coupled to the interconnect fabric and configured to couple the interconnect fabric to a corresponding interconnect fabric on another instance of the integrated circuit, wherein the interconnect fabric and the off-chip interconnect provide an interface that transparently connects the one or more memory controller circuits, the processor cores, graphics processing units, and peripheral devices in either a single instance of the integrated circuit or two or more instances of the integrated circuit.
Public/Granted literature
- US20230058989A1 Scalable System on a Chip Public/Granted day:2023-02-23
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