Invention Grant
- Patent Title: Coil component and method for manufacturing the same
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Application No.: US16285959Application Date: 2019-02-26
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Publication No.: US11804324B2Publication Date: 2023-10-31
- Inventor: Jae Hun Kim , Byeong Cheol Moon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20180083388 2018.07.18
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/32 ; H01F41/12 ; H01F41/04

Abstract:
A coil component includes a body including a coil having a top coil and a bottom coil connected to each other through a via and an external electrode disposed on an external surface of the body to be connected to the coil. A first insulating layer is disposed on a surface of the top coil, and a second insulating layer is disposed on a surface of the bottom coil. The first and second insulating layers are disposed to extend between the top coil and the bottom coil.
Public/Granted literature
- US20200027643A1 COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2020-01-23
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