Invention Grant
- Patent Title: Backside power rail and methods of forming the same
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Application No.: US17572212Application Date: 2022-01-10
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Publication No.: US11804486B2Publication Date: 2023-10-31
- Inventor: Huan-Chieh Su , Li-Zhen Yu , Chun-Yuan Chen , Shih-Chuan Chiu , Cheng-Chi Chuang , Yu-Ming Lin , Chih-Hao Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: HAYNES AND BOONE, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/027 ; H01L21/308 ; H01L21/306

Abstract:
A semiconductor device according to the present disclosure includes a bottom dielectric feature on a substrate, a plurality of channel members directly over the bottom dielectric feature, a gate structure wrapping around each of the plurality of channel members, two first epitaxial features sandwiching the bottom dielectric feature along a first direction, and two second epitaxial features sandwiching the plurality of channel members along the first direction.
Public/Granted literature
- US20220130823A1 BACKSIDE POWER RAIL AND METHODS OF FORMING THE SAME Public/Granted day:2022-04-28
Information query
IPC分类: