Invention Grant
- Patent Title: Semiconductor light-emitting devices and methods of manufacturing the same
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Application No.: US17181213Application Date: 2021-02-22
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Publication No.: US11804513B2Publication Date: 2023-10-31
- Inventor: Sangbum Lee , Inho Kim , Geunwoo Ko , Yongmin Kwon , Juhyun Kim , Jungwook Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR 20200061930 2020.05.22
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L33/00 ; H01L33/38 ; H01L33/44 ; H01L33/50 ; H01L33/60 ; H01L33/62

Abstract:
A semiconductor light-emitting device includes a light-emitting pixel region and a pad region, and includes light-emitting structures, a partition wall structure, a passivation structure, and a fluorescent layer, positioned in the light-emitting pixel region, and a pad unit positioned in the pad region. The partition wall structure includes partition walls defining pixel spaces. The passivation structure surrounds the partition walls and includes a first passivation layer including a first insulating material and a second passivation layer including a second insulating material different from the first insulating material. The passivation structure includes a first portion on a top surface of the partition walls, a second portion on a sidewall of the partition walls, and a third portion between the light-emitting structures and the fluorescent layer. A first thickness of the first portion is less than or equal to a second thickness of the second portion.
Public/Granted literature
- US20210366982A1 SEMICONDUCTOR LIGHT-EMITTING DEVICES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2021-11-25
Information query
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