Invention Grant
- Patent Title: High aspect ratio source or drain structures with abrupt dopant profile
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Application No.: US16580941Application Date: 2019-09-24
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Publication No.: US11804523B2Publication Date: 2023-10-31
- Inventor: Ryan Keech , Anand S. Murthy , Nicholas G. Minutillo , Suresh Vishwanath , Mohammad Hasan , Biswajeet Guha , Subrina Rafique
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/06 ; H01L29/423 ; H01L29/78 ; H01L29/167 ; H01L29/417 ; H01L29/10

Abstract:
Integrated circuit structures having source or drain structures with abrupt dopant profiles are described. In an example, an integrated circuit structure includes a vertical arrangement of horizontal nanowires. A gate stack is around the vertical arrangement of horizontal nanowires. A first epitaxial source or drain structure is at a first end of the vertical arrangement of horizontal nanowires. A second epitaxial source or drain structure is at a second end of the vertical arrangement of horizontal nanowires. The first and second epitaxial source or drain structures include silicon, phosphorous and arsenic, with an atomic concentration of phosphorous substantially the same as an atomic concentration of arsenic.
Public/Granted literature
- US20210091181A1 HIGH ASPECT RATION SOURCE OR DRAIN STRUCTURES WITH ABRUPT DOPANT PROFILE Public/Granted day:2021-03-25
Information query
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